Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill
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چکیده
منابع مشابه
Improvement of Board Level Reliability for BGA Solder Joints Using Underfill
The underfilling BGA as an alternative to direct chip attachment for high density packaging technologies have been developed. This paper discusses the thermomechanical and metallurgical effects of underfill material and the resulting improvement in board level reliability for underfilled BGA assemblies. Finite element analysis (FEA) models were developed to predict the thermal fatigue life of t...
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Single solder interconnects were subjected to a series of combined tension–shear and compression–shear tests to determine their failure load. The failure envelope of these interconnects was obtained by plotting the normal component against the shear component of the failure load. The interconnect failure force map was found to be elliptical like the failure envelopes of many materials. The fail...
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The trend of miniaturization, light weight, high speed and multifunction are common in electronic assemblies, especially, for portable electronic products. In particular, board-level solder joint reliability, in term of both mechanical (e.g., drop impact) and thermo-mechanical (e.g., thermal cycling) loads is of great concern for portable electronic products. The transition to lead-free solder ...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2003
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.44.2175